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USB 3.1 Specification
(.zip file format, size 41.5 MB) provides the technical details to understand USB 3.1 requirements and design USB 3.1 compatible products. Modifications to the USB 3.1 specification are made through Engineering Change Notices (ECNs). Enclosed in this zip file are the following documents:
The USB 3.1 Specification released on July 26, 2013 and ECNs approved through August 11, 2014USB 3.1 Appendix E:& Repeaters
USB 3.0 Adopters Agreement
On-The-Go and Embedded Host Supplement to the USB Revision 3.0 Specification Revision 1.1&as of May 10, 2012Inter-Chip Supplement to the USB Revision 3.0 Specification, Revision 1.02 as of May 19, 2014USB Power Delivery Specification Rev. 2.0, Version 1.0, August 11, 2014 and corresponding Adopters Agreement and ECNs approved through November 26, 2014USB Type-C Cable and Connector Specification Revision 1.0, August 11, 2014 &LIMITED COPYRIGHT LICENSEThe USB 3.0 Promoters grant a conditional copyright license under the copyrights embodied in the USB Type-C Cable and Connector Specification to use and reproduce the Specification for the sole purpose of, and solely to the extent necessary for, evaluating whether to implement the Specification in products that would comply with the specification. Without limiting the foregoing, use of the Specification for the purpose of filing or modifying any patent application to target the Specification or USB compliant products is not authorized. Except for this express copyright license, no other rights or licenses are granted, including without limitation any patent licenses. In order to obtain any additional intellectual property licenses or licensing commitments associated with the Specification a party must execute the USB 3.0 Adopters Agreement. NOTE: By using the Specification, you accept these license terms on your own behalf and, in the case where you are doing this as an employee, on behalf of your employer.LEGAL DISCLAIMER
THIS SPECIFICATION IS PROVIDED "AS IS" AND WITHOUT ANY WARRANTY OF ANY KIND, EXPRESSED OR IMPLIED. WITHOUT LIMITATION, THERE IS NO WARRANTY OF NON-INFRINGEMENT, NO WARRANTY OF MERCHANTABILITY, AND NO WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE. ALL WARRANTIES ARE EXPRESSLY DISCLAIMED.
USER ASSUMES THE FULL RISK OF USING THIS SPECIFICATION. IN NO EVENT SHALL USB-IF OR THE USB 3.0 PROMOTERS BE LIABLE FOR ANY ACTUAL, DIRECT, INDIRECT, PUNITIVE, OR CONSEQUENTIAL DAMAGES ARISING FROM SUCH USE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
USB 3.0 Adopters Agreement (.pdf file format, size 32k)The USB 3.0 Adopters Agreement allows a signing company to participate in a reciprocal, royalty-free licensing arrangement for compliant products. This agreement applies to both the USB 3.0 and USB 3.1 specifications, including USB Power Delivery and USB Type-C Cable and Connector specifications. Any USB 3.0 Adopters Agreement shall only be effective if received within one (1) year after first sale of products that include 'Compliant Products'. See the USB 3.0 Adopters Agreement for details.Archived USB Specifications can be found . Intellectual Property Rights NoticesThis page contains links to a reproduction of letters received by the USB-IF from patent owners asserting intellectual property rights that may be pertinent to the implementation of a USB specification. For specific information regarding the licensing of intellectual property rights arising from a particular USB Specification, the reader should consult the appropriate USB Adopters Agreement for that specification.
Notice to all readers: The USB-IF is providing this information as a courtesy to our members 'AS IS' and without warranty of any kind. The USB-IF is not responsible for content of the individual postings. The USB-IF will not be responsible for identifying patents for which a license may be required by a USB Specification nor for conducting inquiries into the legal validity or scope of those patents that are brought to its attention.
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& , , Inc. or its affiliatesSynopsys全新已流片DesignWare USB 3.0和USB 2.0 femtoPHY IP将面积缩小高达50％
> Synopsys全新已流片DesignWare USB 3.0和USB 2.0 femtoPHY IP将面积缩小高达50％
Synopsys全新已流片DesignWare USB 3.0和USB 2.0 femtoPHY IP将面积缩小高达50％
　　为加速芯片和电子系统创新而提供软件、知识产权(IP)及服务的全球性领先供应商新思科技公司(, Inc.，纳斯达克股票市场代码：SNPS)于日宣布：通过推出全新的DesignWare&USB femtoPHY系列IP，已将的实现面积缩小多达50%;从而可在28nm和14/16nmFinFET工艺节点上，将设计的片芯占用面积和成本降至最低。采用28nm和14nm FinFET硅工艺的DesignWare USB femtoPHY已展示出稳固的性能，使设计师能够在先进工艺技术节点上实现该IP，同时降低系统级芯片()设计风险。DesignWare USB 3.0和USB 2.0 femtoPHY专为极小面积而优化，满足了诸如智能手机和平板电脑等移动设备，以及诸如数字电视、存储等网络应用等大批量消费应用的严苛要求。本文引用地址：
　　DesignWare USB 3.0和USB 2.0 femtoPHY IP(DWC SS USB femtoPHY Samsung 14nm FinFET和DWC HS USB femtoPHY Samsung 14nm FinFET)已经在第三方实验室中通过了USB-IF一致性测试。DesignWare USB femtoPHY达到或超过了USB-IF标准规范，包括5V耐压和3.3V信令体制，提供了有利于系统配置运行全部规格定义功能的强大性能。DesignWare USB femtoPHY支持所有的USB应用模式，为系统设计师提供了一系列多样化的设计选项。DesignWare USB 3.0和USB 2.0 femtoPHY两个产品都支持Hi-Speed高速、Full-Speed全速和Low-Speed低速运行，以及作为主控、设备和OTG等不同配置，同时DesignWare USB 3.0 femtoPHY还支持超高速USB运行(USB 3.0)。
　　&基于我们长期成功使用DesignWare USB IP的经验，我们实现了带有高品质DesignWare USB 3.0和USB 2.0 femtoPHY IP芯片的一次流片成功，&三星电子晶圆代工市场营销副总裁Shawn Han博士表示：&在三星晶圆代工厂中制造的带有DesignWare USB femtoPHY IP的芯片，是首款采用14 nm FinFET工艺的、通过了USB-IF认证的芯片。通过集成一个面积显著缩小的PHY，提高了我们客户系统级芯片的竞争力，并且简化了添加USB连接的过程。的DesignWare femtoPHY够满足大批量移动和消费类应用的成本、功耗、性能和上市时间的需求，它们对于我们在这些快速发展的市场中获得成功至关重要。&
　　开发的USB 3.0和USB 2.0 femtoPHY IP使设计师能够为其应用选择最佳实现方式，而不牺牲USB一致性认证所要求的功能或性能。需要高性能的设计可以使用USB 3.0 femtoPHY符合SuperSpeed USB(USB 3.0)规范的5.0 Gbps数据传输速率。需要较低性能的应用可以使用USB 2.0 femtoPHY符合Hi-Speed USB(USB 2.0)规范的480MHz传输速率。两种DesignWare USB femtoPHY都能够将外部所需的引脚数量降至最低，以进一步缩减SoC的面积和成本。当PHY闲置时，关闭电源这一功能可将电池耗电量降至最低，同时保持所有的PHY状态，以确保快速、精确的上电后功能。此外，DesignWare USB femtoPHY支持广为使用的v1.2USB电池充电规范和USB On-The-Go (OTG) v2.0协议。
　　&18多年来，作为USB-IF的一名活跃成员，Synopsys一直不断地开发相关IP产品，简化了USB 3.0和USB 2.0接口的集成和应用，&USB应用者论坛总裁兼首席运营官Jeff Ravencraft表示道：&获得USB-IF认证表明一款产品符合USB-IF的互操作性标准，并且符合相应的USB规范。Synopsys提供的全新的、面积更小的DesignWare USB 3.0和USB 2.0 femtoPHY，使制造商能够将该技术引入其SoC中。&
　　&SoC设计师已经依靠Synopsys 在3,000多款设计和100多种工艺技术中实现了USB接口，使我们十多年来一直领跑USB IP供应，&Synopsys IP与原型设计市场营销副总裁John Koeter表示：&我们能够为先进工艺技术提供高质量IP这样的专业技术和成功记录，使设计师可集成能够可靠地满足其严格应用需求的IP。随着DesignWare USB 3.0和USB 2.0 femtoPHY IP的面市，以及在FinFET工艺中成功流片，我们将能够帮助我们的客户满足业界对更小的、高性价比的、高性能的SoC需求。&
　　亮点：
　　& DesignWare USB 2.0 femtoPHY IP的面积小于0.2平方毫米，DesignWare USB 3.0 femtoPHY的面积小于0.5平方毫米，使设计师能够节省面积并降低整体硅成本
　　& DesignWare USB 3.0 femtoPHY完全支持USB 2.0，与全球数十亿部设备兼容
　　& 具有关闭电源后保留数据的功能，在确保数据被保存的同时延长电池寿命;支持USB 电池充电v1.2版规范(USB Battery Charging v1.2)，以确保便携式设备的高效充电
　　& DesignWare USB femtoPHY采用减少引脚数量的设计，从而将SoC的外部面积和宽度降至最低
　　& 带有DesignWare USB femtoPHY的28nm和14nm FinFET工艺的消费类芯片已成功流片
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