“工厂”的英文_百度知道
“工厂”的英文
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厂Factory[英][ˈf&#230，制造厂;ri] [美][&#712.工厂;ktəri] n;代理店;fæ
&ktə古&gt
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太给力了，你的回答完美地解决了我的问题，非常感谢！
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制造业中常用的英文缩写QSA：Quality System Audit 品质系统稽核SQE（供应商管理）用的比较多QPA:Quality Process Audit 品质制程稽核GR&R：Gauge repeatability &Reproducibility评价重复性和再现性，是MSA的一种常用方法 MSA（MeasurementSystemAnalysis）使用数理统计和图表的方法对测量系统的分辨率和误差进行分析，以评估测量系统的分辨率和误差对于被测量的参数来说是否合适，并确定测量系统误差的主要成分。品质人员名称类QC quality control 品质管理人员FQC final quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员OQC output quality control 最终出货质量管理人员IQC incoming quality control 进料质量管理人员TQC total quality control 全面质量管理PQC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员QE quality engineering 品质工程人员品质保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认CP capability index 能力指数CPK capability process index 模具制程能力参数SSQA standardized supplier quality audit 合格供货商品质评估FMEA failure model effectiveness analysis 失效模式分析FQC运作类AQL Acceptable Quality Level 运作类允收品质水准S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的Q/R/S Quality/Reliability/Service 品质/可靠度/服务P/N Part Number 料号L/N Lot Number 批号AOD Accept On Deviation 特采UAI Use As It 特采FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一 制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计质量管理GRR Gauge Reproductiveness & Repeatability 量具之再制性及重测性判断量可靠与否 DIM Dimension 尺寸DIA Diameter 直径N Number 样品数其它品质术语类QIT Quality Improvement Team 品质改善小组ZD Zero Defect 零缺点QI Quality Improvement 品质改善QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理RMA Return Material Audit 退料认可7QCTools 7 Quality Control Tools 品管七大手法通用之件类ECN Engineering *****ge Notice 工程变更通知(供货商)ECO Engineering *****ge Order 工程改动要求(客户)PCN Process *****ge Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Standard Inspection Procedure 制程检验标准程序-SOP Standard Operation Procedure 制造作业规范 oIS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单S Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类ES Engineering Standard 工程标准IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格部类PMC Production & Material Control 生产和物料控制PCC Product control center 生产管制中心PPC Production Plan Control 生产计划控制MC Material Control 物料控制DC Document Center 资料中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证(处)QC Quality Control 质量管理(课)PD Product Department 生产部LAB Laboratory 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部生产类PCs Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供货商)识别码SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号OEM Original Equipment Manufacture 原设备制造PC Personal Computer 个人计算机CPU Central Processing Unit 中央处理器 oA.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量I/O input/output 输入/输出NG Not Good 不行,不合格C=0 Critical=0 极严重不允许APP Approve 核准,认可,承认CHK Check 确认ASS'Y Assembly 装配,组装T/P True Position 真位度5WIH When, Where, Who, What, Why, How to6M Man, Machine, Material, Method, Measurement, Message4M1H Man, Material, Money, Method, Time, How 人力,物力,财务,技术,时间(资源) SQA Strategy Quality Assurance 策略品质保证DQA Design Quality Assurance 设计品质保证QA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证LRR Lot Reject Rate 批退率DVD Digital Video DiskVCD Video Compact DiskLCD Liquid Crystal DisplayCAD Computer Aided DesignCAM Computer Aided ManufacturingCAE Computer Aided EngineeringPCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WDR Weekly Delivery Requirement 周出货要求PPM Percent Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OS Operation System 操作系统TBA To Be Assured 待定,定缺D/C Drawing *****geP/P Plans & ProcedureEMI Electrical-Music Industry 电子音乐工业 Electrical Magnetic Interference 电子干扰RFI Read Frequency Input 读频输入MMC Maximum Material ConditionMMS Maximum Material Size XsLMC Least Material ConditionLMS Least Material Size UmLED lighting-emitting diode 发光二极管QBR Quarter Business RecordCIP Continuous improvement processFGI Forecasted Goal InventoryCNC Computerized numeral controllerB2C Business to customerB2B Business to businessAVL Approved vendor listOP Procedure of packagingEOL End of lifeVDCS Vender defect correcting sheetPDCS Process defect correcting sheetGRN Goods receiving noteA/R Accounting receivableA/P Accounting payable部门名称的专有名词QS :Quality system品质系统CS: Coutomer Sevice 客户服务QC: Quality control品质管理IQC: Incoming quality control 进料检验LQC: Line Quality Control 生产线品质控制IPQC: In process quality control 制程检验FQC: Final quality control 最终检验OQC: Outgoing quality control 出货检验QA: Quality assurance 品质保证SQA: Source(supplier) Quality Assurance 供应商品质保证(VQA)CQA：Customer Quality Assurance客户质量保证PQA: Process Quality Assurance 制程品质保证QE: Quality engineer 品质工程CE: component engineering零件工程EE: equipment engineering设备工程ME: manufacturing engineering制造工程TE: testing engineering测试工程PPE: Product Engineer 产品工程IE: Industrial engineer 工业工程ADM: Administration Department行政部RMA:客户退回维修CSDI:检修PC: producing control生管MC: mater control物管GAD: General Affairs Dept总务部A/D: Accountant /Finance Dept会计LAB: Laboratory实验室DOE:实验设计HR:人资PMC:企划RD:研发W/H:仓库SI:客验PD: Product Department生产部PA:采购(PUR: Purchasing Dept)SMT:Surface mount technology 表面粘着技术 MFG:Manufacturing 制造MIS:Management information system 资迅管理系统 DCC:document control center 文件管制中心 厂内作业中的专有名词QT:Quality target品质目标QP:Quality policy目标方针QI:Quality improvement品质改善CRITICAL DEFECT:严重缺点（CR）MAJOR DEFECT:主要缺点（MA）MINOR DEFECT:次要缺点（MI）MAX: Maximum最大值MIN: Minimum最小值DIA: Diameter直径DIM: Dimension尺寸LCL: Lower control limit管制下限UCL: Upper control limit管制上限EMI:电磁干扰ESD:静电防护EPA:静电保护区域ECN:工程变更ECO: Engineering change order工程改动要求（客户） ECR:工程变更需求单CPI: Continuous Process Improvement 连续工序改善 DWG: Drawing图面ZD: Zero defect零缺点BOM:Bill of material物料清单CPU: central processing unit(中央处理器)IC: Integrated circuit(集成电路)Memory IC: Memory Integrated circuit（记忆集成电路）RAM: Random Access Memory（随机存取存储器）DRAM: Dynamic Random Access Memory（动态随机存取存储器）SRAM: Staic Random Access Memory（静态随机存储器）ROM: Read-only Memory（只读存储器）EPROM:Electrical Programmable Read-only Memory（电可抹只读存诸器）EEPROM: Electrical Erasbale Programmable Read-only Memory（电可抹可编程只读存储器）CMOS: Complementary Metal-Oxide-Semiconductor（互补金属氧化物半导体）BIOS: Basic Input Output System（基本输入输出系统）LED:发光二极体ID：identification识别,鉴别,证明PILOT RUN: (试投产)FAI:首件检查FPIR：First Piece Inspection Report首件检查报告FAA:首件确认SPC：统计制程管制CP: capability index（准确度）CPK: capability index of process(制程能力)PMP:制程管理计划（生产管制计划）MPI:制程分析DAS: Defects Analysis System 缺陷分析系统PPB：十亿分之一Flux：助焊剂P/N:料号L/N：Lot Number批号Version：版本Quantity：数量Valid date：有效日期MIL-STD：Military-Standard军用标准ICT: In Circuit Test (线路测试)ATE：Automatic Test Equipment自动测试设备MO: Manafacture Order生产单T/U: Touch Up (锡面修补)I/N:手插件P/T:初测F/T: Function Test (功能测试-终测)ASY:组立P/K:包装TQM:Total quality control全面品质管理MDA:manufacturing defect analysis制程不良分析(ICT)RUN-IN:老化实验HI-pot：高压测试FMI：Frequency Modulation Inspect高频测试DPPM: Defect Part Per Million(不良率的一种表达方式：百万分之一) 1000PPM即为0.1%Corrective Action: (CAR改善对策)ACC：允收REJ:拒收S/S：Sample size抽样检验样本大小SI-SIV：Special I-Special IV特殊抽样水平等级CON：Concession / Waive特采ISO:国际标准化组织ISA：Industry Standard Architecture工业标准体制结构OBA:开箱稽核FIFO:先进先出PDCA:管理循环Plan do check action计划，执行，检查，总结WIP:在制品（半成品）S/O: Sales Order (业务订单)P/O: Purchase Order (采购订单)P/R: Purchase Request (请购单)AQL:acceptable quality level允收品质水准LQL;Limiting quality level最低品质水准QVL:qualified vendor list合格供应商名册AVL ：认可的供货商清单(Approved Vendor List)QCD: Quality cost delivery（品质，交期，成本）MPM:Manufacturing project management制造专案管理KPI:Key performance indicate重要绩效指标MVT:Manufacturing Verification Test制造验证试产Q/R/S：Quality/Reliability/Service质量/可靠度/服务STL:ship to line（料到上线）NTF:No trouble found误判CIP:capacity improvement plan（产能改善计划）MRB:material review board（物料审核小组）MRB:Material reject bill退货单JIT:just in time（即时管理）5S:seiri seiton seiso seiketsu shitsuke（整理，整顿，清扫，清洁，修养） SOP:standard operation process（标准作业程序）SIP:Specification inspection process制程检验规格TOP: Test Operation Process (测试作业流程)WI: working instruction（作业指导书）SMD:surface mounting device（表面粘着原件）FAR:failure aualysis report故障分析报告CAR:Corrective action report改善报告BPR： 企业流程再造 (Business Process Reengineering) ISAR ：首批样品认可(Initial Sample Approval Request)- JIT：实时管理 (Just In Time)QCC ：品管圈 (Quality Control Circle)Engineering Department (工程部)TQEM: Total Quality Environment Management(全面品质环境管理)PD: Production Department (制造)LOG: Logistics (后勤支持)Shipping: (进出口)AOQ：Average Output Quality平均出货质量AOQL：Average Output Quality Level平均出货质量水平 FMEA：failure model effectiveness analysis失效模式分析 CRB: Change Review Board (工程变更会议)CSA：Customer Simulate Analysis客户模拟分析SQMS：Supplier Quality Management System供应商品质管理系统 QIT: Quality Improvement Team 品质改善小组QIP：Quality Improvement Plan品质改善计划CIP：Continual Improvement Plan持续改善计划M.Q.F.S: Material Quality Feedback Sheet (来料品质回馈单) SCAR: Supplier Corrective Action Report (供货商改善对策报告) 8D Sheet: 8 Disciplines sheet ( 8D单)PDCA：PDCA (Plan-Do-Check-Action) (管理循环)MPQ: Material Packing Quantity (物料最小包装量)DSCN: Delivery Schedule Change Notice (交期变更通知) QAPS: Quality Assurance Process Sheet (品质工程表)DRP ：运销资源计划 (Distribution Resource Planning) DSS：决策支持系统 (Decision Support System)EC ：电子商务 (Electronic Commerce)EDI ：电子资料交换 (Electronic Data Interchange)EIS ：主管决策系统 (Excutive Information System)ＥＲＰ ：企业资源规划 (Enterprise Resource Planning) FMS ：弹性制造系统 (Flexible Manufacture System)KM ：知识管理 (Knowledge Management)4L ：逐批订购法 (Lot-for-Lot)LTC ：最小总成本法 (Least Total Cost)LUC ：最小单位成本 (Least Unit Cost)MES ：制造执行系统 (Manufacturing Execution System) MPS ：主生产排程 (Master Production Schedule)MRP ：物料需求规划 (Material Requirement Planning)MRPⅡ：制造资源计划 (Manufacturing Resource Planning) OEM ：委托代工 (Original Equipment Manufacture)ODM ：委托设计与制造 (Original Design & Manufacture)OLAP：线上分析处理 (On-Line Analytical Processing)OLTP：线上交易处理 (On-Line Transaction Processing)OPT ：最佳生产技术 (Optimized Production Technology)PDCA：PDCA管理循环 (Plan-Do-Check-Action)PDM：产品数据管理系统 (Product Data Management))RCCP：粗略产能规划 (Rough Cut Capacity Planning)SCM ：供应链管理 (Supply Chain Management)SFC ：现场控制 (Shop Floor Control)TOC：限制理论 (Theory of Constraints)TQC ：全面品质管制 (Total Quality Control)FYI/R:for your information/reference仅供参考ASAP:尽快S/T:Standard time标准时间TPM:total production maintenance：全面生产保养IT:information technology信息技术，资讯科学CEO：Chief Executive Officer执行总裁COO：Chief Operaring Officer首席业务总裁SWOT：Strength,Weakness,Opportunity,Threat优势o弱点o机会o威胁 IDP：Individual Development Plan个人发展计划MRP：Material Requirement Planning物料需求计划MAT'S：Material材料LRR：Lot Rejeet Rate批退率ATIN：Attention知会3C：Computer ,Communication , Consumer electronic消费性电子5W1H：When , Where , Who , What , Why , Ho5M: Man , Machine , Material , Method , Measurement人,机器,材料,方法,测量4MIE: Man,Material,Machine,Method,Environment人力,物力,财务,技术,时间(资源)7M1I: Manpower , Machine , Material , Method, Market , Management , Money , Information人力， 机器， 材料， 方法, 市场， 管理， 资金， 资讯 FA: Failure Analysis 失效分析5S5S整理,整顿,清扫,清洁,教养6Sigma6Sigma六标准差A/IAutoInsertion自动插件AQLAcceptQualityLevel允收水平B/IBurn-In高温热机(老化)过程BOMBillOfMaterial材料明细表BTOBuildToOrder接单生产CAD/CAMComputerAidedDesign/Manufacturing计算机辅助设计/制造CALCalibration仪器校验(仪校)CARCorrectiveActionResponse改善对策报告CCRCustomerComplainRequirement客户抱怨/要求ChargeCharge索取费用CNDCannotDuplicate无法复制,异常现象消失CRCritical严重(CR&MA&MI)CSCustomerService客户服务CTOConfigureToOrder接单组装DebitNoteDebitNote(会计)帐目通知DELL'sSurveyFormDELL'sSurveyFormDELL公司稽核供货商的文件 ECNEngineeringChangeNotice工程变更通知ECREngineeringChangeRequest工程变更要求EMIElectroMagneticInterference电磁干扰ENGEngineering工程(部)ESDElectrostaticDischarge静电放电FAEFieldApplicationEngineering客诉前置处理单位FAIFirstArticleInspection首件检查FNFactoryNotice工厂通知FRRFieldReturnRate市场退修率FRUFieldReplacementUnit市场不良回修更换套件Hi-PotHi-Pot耐电压测试HoldHold(shipping,production?)停止(出货,生产?)ICTIn-CircuitTest(PC板)电路测试IEIndustrialEngineering工业工程IPQCIn-ProcessQualityControl制程质量管理IQCIncomingQualityControl进料质量管理ISOInternationalOrganizationforStandardization国际标准组织 JITJustInTime实时(行动,入料?)MAMajor主要MEMechanicalEngineering机械工程MFGManufacturing制造部(业)MIMinor次要MISManagementInformationSystem信息管理系统MPMassProduction量产(亦指制造部)MRBMaterialReviewBoardVQA材料异常会阅MTBFMeanTimeBetweenFailure平均失效时间O/IOperationalInstruction作业指导书ODMOriginalDevelopingManufacturer原始设计生产OEMOriginalEquipmentManufacturer原始配备生产ORTOn-goingReliablityTest在制品可靠度测试P/NPartNumber品名P/OPurchaseOrder采购下订单(P/O-&S/O-&W/O)P/RPilot-Run试作验证PDCAPlanDoCheckAction戴明循环PEProductionEngineering制造工程(部)PPMPartPerMillion百万分之一(质量计算单位)PreformingPreforming预加工QAQualityAssurance品质保证QCCAQualityControlCircleActivities品管圈活动QCQualityControl质量管理QISQualityInformationSystem质量信息系统R/IRun-In常温热机(老化)过程REVRevision版本RMAReturnMerchandiseApproval(orAuthorization)退货品认可RTVReturnToVendor退回厂商S/NSerialNumber序号S/OSalesOrder业务下订单SafetySafety安全规格(安规)SMTSurfaceMountingTechnology表面黏着技术SPCStatisticsProcessControl统计制程管制SPECSpecification规格SWOTStrengthWeaknessesOpportunitiesThreats强势弱势潜在机会威胁TETestEngineering测试工程TPMTotalProductiveMaintenance全面性生产维护TQMTotalQualityManagement全面质量管理TUVTUV德国莱茵技术监护顾问公司(安规单位)ULUnderwritersLaboratories美国保险协会实验室(安规单位)VQAVenderQualityApproval供货商质量保证(雷同进料检验)W/OWorkOrder生产工单WIPWorkInProcess尚未完成的在制品P/N ------ Part Number 料号P/R ------ Purchase Request (物控release给采购的)请购单P/O ------ Purchase Order (采购release给厂商的)订单PMC ------ Production & Material Control 生管&物控管理PM ------ Production Management 整个生产管理(包括生管物控产销)MC ------ Material Control (企划)物控PC ------ Production Control (企划)生管PL------ Project Leader 项目管理(针对大客户大订单的专门全面管理 主要是Pilot Run 阶段及其前期工作)OM ------ Order Management 订单管理(量产之后的订单答交p生产进度跟踪p工令管理pECN变更p出货排程等)PMP ------ Project Management Plan 项目(订单)管理计划书PIC ------ Person In Charge (项目)负责人COPP ------ORT ------ Ongoing Reliability Test生产过程中的可靠度测试UCL ------ Up Control Line 上管制线LCL ------ Low Control Line 下管制线FAI ------PVT ------ Process Verification Test Pilot Run试生产第一阶段先作PVT再作MVB. MVB ------ Mass Verification Board Pilot Run试生产之第二阶段M/P ------ Mass Production量产/大批量生产BTF ------ Build To Forecast 依据销售预测进行生产BTO ------ Build To Order 依据订单生产CTO ------ Configuration To Order客制化生产PTD ------ Production To DepartureCRM ------ Customer Relationship Management 客户关系管理CRP ------ Capacity Requirements Planning 产能需求规划ERP ------ Enterprise Resource Planning 企业资源规划FMS ------ Flexible Manufacture System 弹性制造系统BOM ------ Bill Of Material 物料清单MPS ------ Master Production Scheduling 主生产排程指根据业务接单或销售预测所排定一段期间之产品生产计划须指定何种产品应于何时制造完成多少数量.MRP ------ Material Requirement Planning 物料需求规划MRP之计算依照MPS之产品独立需求透过BOM展开之零组件相依需求配合当时存货状况以求得某段期间内应投入生产或执行采购之计划方针.WIP ------ Work In Process 在制品FG ------ Finished Goods制成品/产成品E&O ------ Excess & Order/Backlog 呆滞在途(订单)EOL ------ End Of Line产品寿命中止(停止生产)MES------Manufacturing Execution System制造执行系统 辅助生管人员收集现场数据及控制现场制造流程提供企业改善制程、提高生产效益的工具.大部分的MES系统模块皆会包括订单管理系统(Customer Order Management COM)p物料管理系统(Material Management System MMS)p制程控管系统(Work In Process Tracking WIP)p生产排程系统(Production Scheduling System PSS)p质量控管系统(Statistical Process Control SPC)p设备控管系统(Equipment Management System EMS)及对外部系统的PDM整合接口(PDM Integration Interface)与ERP整合接口(ERP Integration Interface)等模块.OEM ------ Original Equipment Manufacture委托代工ODM ------ Original Design & Manufacture 委托设计与制造AVL ------ Approved Vendor List 具备资格/被认可的厂商名册SCM ------ Supply Chain Management供应链管理SLM ------ Supply Line Management 供应链管理产品由起始原料转换成完成品至最终到达顾客手上之流动过程中影响其执行绩效的个体组合而成之网络称为供应链供应链的组成个体可能包括：供货商→制造→工厂→配销点→零售商→最终顾客;而供应链管理之定义简单而言就是需求与供应适当的结合以达到资源z人p设备p物p资金{运用与分配之有效性与及时性.EC ------ Engineer Change设计变更/工程变更EC ------ Electronic Commerce 电子商务ECN ------ Engineer Change Notice工程变更通知书S/O ------ Shipping Order 装货通知单S/A ------ Shipping Advice出货通知比“SI”先行S/I ------ Shipping Invoice 正式的出货文件/发货单P/L ------ Packing List (出货)装箱单B/L ------ Bill of Leading 提货单/提单N/W ------ Net Weight 净重ETD/E.T.D/e.t.d ------ Expected Time of Departure (货船)预定开航时间ETA/E.T.A/e.t.a ------ Expected Time of Auuival预定到达时间CAT ------ Component Approval Team零件承认组KPI ------ Key Part Index 关键指标二.财务会计 专有名词A/R ------ Account Receivable应收帐款A/P ------ Account Payment应付帐款Deduct AP ------ 扣除应付帐款/不良扣款T/T ------ Telegraph Transfer汇转帐(付款)OA 30天 ------ 货到30天后付款(如11/5到货则12/5付款)月结30天 ------ 货送到后下月底付款(如11/5到货则12/30付款)ID ------ Input Duty 关税VAT ------ Value Add Tax 增值税三. 品管 专有名词IQC ------ Incoming Quality Control 进料质量控制IPQC------ In-Process Quality Control 制程质量管理:产品未完成前尚在制程中的品管工作 FQC ------ Finish or Final Quality Control 成品质量管理:成品未装箱前的品管工作. QE ------ Quality Engineering 质量工程FAE ------ Final Application Engineer终端应用工程部门(属R&D范畴) 又称为 AED --- Application Engineer Department.FAE ------ Finished Application Engineer 成品应用工程CPSR ------ Customer Product Standard Request客户产品规格标准要求QA ------ Quality Assure 品质保证OQA ------ Out-going Quality Assure 出货品质保证对厂内生产线的产品进行检验及测试 范围包括: 产品外观ECN是否最新版产品结构是否符合ECN附属配件是否齐全(CD-PROMENU)包装方法是否符合客户要求产品性能检验测试(能否正常运行与其它产品的兼容性等).DIST机种用3种固定规格的CPUHDD进行测试项目机种按客户提供的固定程序测试项目相对较少时间较短.OQA 0.0 ------ 出货failure rate(不良率)为0.0%之品质保证OOB ------ Out Of Box 开箱检查包括产品功能及兼容性测试除需进行与OQA相同的检验及测试之外还要设法取得客户信息仿真客户端系统使用状况进行产品兼容性测试对客户可能采用的各种规格型号之HDDCPUFLOPPY等均需进行测试测试项目较多时间较长所需的测试程序和测试治具比OQA要多OQC ------ Out-going Quality Control 出货质量管理TQM ------ Total Quality Management 全面质量管理TQC ------ Total Quality Control全面质量管理QIT ------ Quality Improvement Team质量改善小组QIP ------ Quality Improvement Plan质量改善计划CAR ------ Correction Action Require质量异常修正联络单工厂内部各制造及技X部门互相可发出此联络单内容广泛包括制程p材料p人为因素等造成的质量异常要求相关责任单位改善.如: OQA发出的CAR为“OQA退货修正联络单”交由PE分析并提出改进措施.SCAR ------ Supplier Correction Action Require 供货商质量改善联络单IQC发给厂商的联络单PUSH厂商针对我们提出的质量问题研究并实行改善措施厂商接到此单后即会回复改善措施.CLCA ------ Close Loop Correction Action循环改善措施 其循环流程为: 制造将质量异常反应给IQCIQC发出SCAR 厂商回馈改善措施 SQE对厂商的改善措施是否能有效解决质量异常作进一步确认LTQ ------ Lead ship Through Quality质量领导机制AQL ------ Acceptable Quality Level 消费者可接受之最高不良率KM ------ Knowledge Management 知识管理SFC ------ Shop Floor Control(生产)现场控制Batch Reject Rate / Lot Reject Rate批通率Defect Rate 不良率ISO ------International Organization for Standardization国际标准组织PDM ------ Product Data Management 产品数据管理系统协助工程师进行数据管理让企业透过标准程序管制提高整体效率并使作业程序电子化及标准化.用来管理特定产品从研发到量产之生命周期里全程/各点产生的一切信息例如CAD图面p3D模型数据pNC程序pCAE分析结果 测试数据p设计历史和相关制程文件.OPT ------ Optimized Production Technology 最佳生产技术任何企业的真正目标是现在和未来都赚钱;要实现这个目标必须在增加产销率的同时减少库存和营运费用.PDCA ------ 品管之“PDCA”管理模式: Plan→Do→Check→ActionPDSA ------ 品管之“PDSA”管理模式: Plan→Do→Study→ActionCLCA ------5S ------ 5S是由企业研究出来的一种环境塑造方案其目的在藉由整理(SEIRI)p整/顿(SEITON)p清扫(SEISO)p清洁(SEIKETSU)及身美(SHITSUKE)五种行为来创造清洁p明朗p活泼化之环境以提高效率p质量及顾客满意度.5S活动的对象/是现场的环境它对生产现场环境全局进行综合考虑并制订切实可行的计划与措施从而达到规范化管理.四. 计算机软硬件 专有名词PCB ------ Printed Circuit Board 印刷电路板PCA ------ Printed Circuit Assembly印制电路插件M/B ------ Mother Board / Main Board 主机板/主板/母板B/B ------ BareBone 系统半成品又称“准系统”或称“裸机”由OEM客户指定其配备 通常由下列部分组成:Case+power supply+M/B+CD ROM+HDD+FDD 由OEM客户自行增添:CPU+RAM等即成为完整的系统system.HD ------ Hard Disk 硬盘HDD ------ Hard Disk Drive 硬盘驱动器Floppy Disk软盘/软磁盘FDD ------ Floppy Disk Drive 软盘驱动器/软磁盘机CD/CDPRO ------ Compact Disc 激光唱盘/光盘CD-ROM/ CD-ROM drive 光盘驱动器CDROM 只读光盘品质人员名称类QC quality control 品质管理人员FQC final quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员 OQC output quality control 最终出货质量管理人员 IQC incoming quality control 进料质量管理人员 TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员 QE quality engineering 品质工程人员品质保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认TVR tool verification report 模具确认报告3B 3B 模具正式投产前确认CP capability index 能力指数CPK capability index of process 模具制程能力参数SSQA standardized supplier quality 合格供货商品质评估 OOBA out of box audit 开箱检查QFD quality function deployment 品质机能展开FMEA failure model effectiveness analysis 失效模式分析 8 disciplines 8项回复内容FA final audit 最后一次稽核CAR corrective action request 改正行动要求corrective action report 改正行动报告FQC运作类AQL Acceptable Quality Level 运作类允收品质水准 S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的AOQ Average Output Quality 平均出厂品质AOQL Average Output Quality Level 平均出厂品质 Q/R/S Quality/Reliability/Service 品质/可靠度服务 MIL-STD Military-Standard 军用标准S I-S IV Special I-Special IV 特殊抽样水准等级 P/N Part Number 料号L/N Lot Number 特采AOD Accept On Deviation 特采UAI Use As It 首件检查报告FPIR First Piece Inspection Report 百万分之一 PPM Percent Per Million 批号制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计质量管理R Range 全距AR Averary Range 全距平均值UCL Upper Central Limit 管制上限LCL Lower Central Limit 管制下限MAX Maximum 最大值MIN Minimum 最小值GRR Gauge Reproducibility&Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径FREQ Frequency 频率N Number 样品数其它品质术语类QCC Quality Control Circle 品质圈QIT Quality Improvement Team 品质改善小组PDCA Plan Do Check Action 计划 执行 检查 总结ZD Zero Defect 零缺点QI Quality Improvement 品质改善QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理MRB Material Reject Bill 退货单LQL Limiting Quality Level 最低品质水准RMA Return Material Audit 退料认可QAN Quality Amelionrate Notice 品质改善活动ADM Absolute Dimension Measuremat 全尺寸测量QT Quality Target 品质目标7QCTools 7 Quality Controll Tools 品管七大手法通用之件类ECN Engineering Change Notes 工程变更通知(供货商)ECO Engineering Change Order 工程改动要求(客户)PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Specification In Process 制程检验规格SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类QC Quality System 品质系统ES Engineering Standarization 工程标准CGOO China General PCE龙华厂文件H Huston (美国)休斯敦C Compaq (美国)康伯公司C China 中国大陆A Assembly 组装(厂)S Stamping 冲压(厂)P Painting 烤漆(厂)I Intel 英特尔公司T TAIWAN 台湾IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格CMCS C-China M-Manufact C-Compaq S-Stamping Compaq产品在龙华冲压厂制造作业规范CQCA Q-Quality A-Assembly Compaq产品在龙华组装厂品管作业规范 CQCP P-Painting Compaq产品在龙华烤漆厂品管作业规范部类PMC Production & Material Control 生产和物料控制PPC Production Plan Control 生产计划控制MC Material Control 物料控制ME Manafacture Engineering 制造工程部PE Project Engineering 产品工程部A/C Accountant Dept 会计部P/A Personal & Administration 人事行政部DC Document Center 资料中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证(处)QC Quality Control 质量管理(课)PD Product Department 生产部LAB Labratry 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部P Painting 烤漆(厂)A Asssembly 组装(厂)S Stamping 冲压(厂)生产类PCS Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供货商)识别码SWR Special Work Request 特殊工作需求L/N Lot Number 批号P/N Part Number 料号其它OEM Original Equipment Manufacture 原设备制造 PCE Personal Computer Enclosure 个人计算机外设 PC Personal Computer 个人计算机CPU Central Processing Unit 中央处理器SECC SECC` 电解片SGCC SGCC 热浸镀锌材料NHK North of Hongkong 中国大陆PRC People's Republic of China 中国大陆U.S.A the United States of America 美国A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量VS 以及REV Revision 版本JIT Just In Time 零库存I/O Input/Output 输入/输出OK Ok 好NG Not Good 不行,不合格C=0 Critical=0 极严重不允许ESD Electry-static Discharge 静电排放5S 希腊语 整理,整顿,清扫,清洁,教养ATIN Attention 知会CC Carbon Copy 副本复印相关人员APP Approve 核准,认可,承认CHK Check 确认AM Ante Meridian 上午PM Post Meridian 下午CD Compact Disk 光盘CD-ROM Compact Disk Read-Only Memory 只读光盘 FDD Floppy Disk Drive 软盘机HDD Hard Disk Drive 碟碟机REF Reference 仅供参考CONN Connector 连接器CAV Cavity 模穴CAD Computer Aid Design 计算器辅助设计 ASS'Y Assembly 装配,组装MAT'S Material 材料IC Integrated Circuit 集成电路T/P True Position 真位度TYP Type 类型WDR Weekly Delivery Requitement 周出货需求C?T Cycle Time 制程周期L/T Lead Time 前置时间(生产前准备时间)S/T Standard Time 标准时间P/M Product Market 产品市场3C Computer,Commumcation,Consumer electronic's 消费性电子5WIH When,Where,Who,What,Why,How to5M Man,Machine,Material,Method,Measurement4MIH Man,Materia,Money,Method,Time 人力,物力,财务,技术,时间(资源) SQA Strategy Quality Assurance 策略品质保证DQA Desigh Quality Assurance 设计品质保证MQA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证LRR Lot Rejeet Rate 批退率BS Brain storming 脑力激荡EMI Electronic Magnetion Inspect 高磁测试FMI Frequency Modulatim Inspect 高频测试B/M Boar/Molding(flat cable)C/P Connector of PCA/P AssemblySPS Switching power supply 电源箱DT Desk Top 卧式(机箱)MT Mini-Tower 立式(机箱)DVD Digital Vedio DiskVCD Vdeio Compact DiskLCD Liquid Crystal DisplayCAD Computer AID DesignCAM Computer AID ManufacturingCAE Computer AID EngineeringABIOS Achanced Basic in put/output system 先进的基本输入/输出系统CMOS Complemeruary Metoll Oxide Semiconductor 互补金属氧化物半导体 PDA Personal Digital Assistant 个人数字助理IC Integrated Circuit 集成电路ISA Industry Standard Architecture 工业标准体制结构MCA Micro Channel Architecture 微信道结构EISA Extended Industry Standard Architecture 扩充的工业标准结构 SIMM Single in-line memory module 单项导通汇流组件DIMM Dual in-line Memory Module 双项导通汇流组件LED Light-Emitting Diode 发光二级管FMEA Failure Mode Effectivenes 失效模式分析W/H Wire Harness 金属线绪束集组件F/C Flat Calle 排线PCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WPR Weekly Delivery Requirement 周出货要求PPM Parts Per Million 百万分之一TPM Total Production Maintenance 全面生产保养 MRP Material Requiremcnt Planning 物料需计划 OC Operation System 操作系统TBA To Be Design 待定,定缺D/C Drawing ChangeP/P Plans & ProceduneEMI Electrical-Music Industry 电子音乐工业RFI Read Frequency Input 读频输入品质人员名称类QC quality control 品质管理人员FQC final quality control 终点质量管理人员IPQC in process quality control 制程中的质量管理人员 OQC output quality control 最终出货质量管理人员 IQC incoming quality control 进料质量管理人员 TQC total quality control 全面质量管理POC passage quality control 段检人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员 QE quality engineering 品质工程人员品质保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认TVR tool verification report 模具确认报告3B 3B 模具正式投产前确认CP capability index 能力指数CPK capability index of process 模具制程能力参数SSQA standardized supplier quality 合格供货商品质评估 OOBA out of box audit 开箱检查QFD quality function deployment 品质机能展开FMEA failure model effectiveness analysis 失效模式分析 8 disciplines 8项回复内容FA final audit 最后一次稽核CAR corrective action request 改正行动要求corrective action report 改正行动报告FQC运作类AQL Acceptable Quality Level 运作类允收品质水准 S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的AOQ Average Output Quality 平均出厂品质AOQL Average Output Quality Level 平均出厂品质Q/R/S Quality/Reliability/Service 品质/可靠度服务MIL-STD Military-Standard 军用标准S I-S IV Special I-Special IV 特殊抽样水准等级P/N Part Number 料号L/N Lot Number 特采AOD Accept On Deviation 特采UAI Use As It 首件检查报告FPIR First Piece Inspection Report 百万分之一PPM Percent Per Million 批号制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计质量管理R Range 全距AR Averary Range 全距平均值UCL Upper Central Limit 管制上限LCL Lower Central Limit 管制下限MAX Maximum 最大值MIN Minimum 最小值GRR Gauge Reproducibility&Repeatability 量具之再制性及重测性判断量可靠与否DIM Dimension 尺寸DIA Diameter 直径FREQ Frequency 频率N Number 样品数其它品质术语类QCC Quality Control Circle 品质圈QIT Quality Improvement Team 品质改善小组PDCA Plan Do Check Action 计划 执行 检查 总结ZD Zero Defect 零缺点QI Quality Improvement 品质改善QP Quality Policy 目标方针TQM Total Quality Management 全面品质管理MRB Material Reject Bill 退货单LQL Limiting Quality Level 最低品质水准RMA Return Material Audit 退料认可QAN Quality Amelionrate Notice 品质改善活动ADM Absolute Dimension Measuremat 全尺寸测量QT Quality Target 品质目标7QCTools 7 Quality Controll Tools 品管七大手法通用之件类ECN Engineering Change Notes 工程变更通知(供货商)ECO Engineering Change Order 工程改动要求(客户)PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Specification In Process 制程检验规格SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格DWG Drawing 图面系统文件类QC Quality System 品质系统ES Engineering Standarization 工程标准CGOO China General PCE龙华厂文件H Huston (美国)休斯敦C Compaq (美国)康伯公司C China 中国大陆A Assembly 组装(厂)S Stamping 冲压(厂)P Painting 烤漆(厂)I Intel 英特尔公司T TAIWAN 台湾IWS International Workman Standard 工艺标准ISO International Standard Organization 国际标准化组织GS General Specification 一般规格CMCS C-China M-Manufact C-Compaq S-Stamping Compaq产品在龙华冲压厂制造作业规范CQCA Q-Quality A-Assembly Compaq产品在龙华组装厂品管作业规范 CQCP P-Painting Compaq产品在龙华烤漆厂品管作业规范部类PMC Production & Material Control 生产和物料控制PPC Production Plan Control 生产计划控制MC Material Control 物料控制ME Manafacture Engineering 制造工程部PE Project Engineering 产品工程部A/C Accountant Dept 会计部P/A Personal & Administration 人事行政部DC Document Center 资料中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证(处)QC Quality Control 质量管理(课)PD Product Department 生产部LAB Labratry 实验室IE Industrial Engineering 工业工程R&D Research & Design 设计开发部P Painting 烤漆(厂)A Asssembly 组装(厂)S Stamping 冲压(厂)生产类PCS Pieces 个(根,块等)PRS Pairs 双(对等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供货商)识别码SWR Special Work Request 特殊工作需求 L/N Lot Number 批号P/N Part Number 料号其它OEM Original Equipment Manufacture 原设备制造 PCE Personal Computer Enclosure 个人计算机外设 PC Personal Computer 个人计算机CPU Central Processing Unit 中央处理器 SECC SECC` 电解片SGCC SGCC 热浸镀锌材料NHK North of Hongkong 中国大陆PRC People's Republic of China 中国大陆 U.S.A the United States of America 美国A.S.A.P As Soon As Possible 尽可能快的 E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量VS 以及REV Revision 版本JIT Just In Time 零库存I/O Input/Output 输入/输出OK Ok 好NG Not Good 不行,不合格C=0 Critical=0 极严重不允许ESD Electry-static Discharge 静电排放5S 希腊语 整理,整顿,清扫,清洁,教养ATIN Attention 知会CC Carbon Copy 副本复印相关人员APP Approve 核准,认可,承认CHK Check 确认AM Ante Meridian 上午PM Post Meridian 下午CD Compact Disk 光盘CD-ROM Compact Disk Read-Only Memory 只读光盘FDD Floppy Disk Drive 软盘机HDD Hard Disk Drive 碟碟机REF Reference 仅供参考CONN Connector 连接器CAV Cavity 模穴CAD Computer Aid Design 计算器辅助设计ASS'Y Assembly 装配,组装MAT'S Material 材料IC Integrated Circuit 集成电路T/P True Position 真位度TYP Type 类型WDR Weekly Delivery Requitement 周出货需求C?T Cycle Time 制程周期L/T Lead Time 前置时间(生产前准备时间)S/T Standard Time 标准时间P/M Product Market 产品市场3C Computer,Commumcation,Consumer electronic's 消费性电子 5WIH When,Where,Who,What,Why,How to5M Man,Machine,Material,Method,Measurement4MIH Man,Materia,Money,Method,Time 人力,物力,财务,技术,时间(资源) SQA Strategy Quality Assurance 策略品质保证DQA Desigh Quality Assurance 设计品质保证MQA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证 LRR Lot Rejeet Rate 批退率BS Brain storming 脑力激荡EMI Electronic Magnetion Inspect 高磁测试FMI Frequency Modulatim Inspect 高频测试B/M Boar/Molding(flat cable)C/P Connector of PCA/P AssemblySPS Switching power supply 电源箱DT Desk Top 卧式(机箱)MT Mini-Tower 立式(机箱)DVD Digital Vedio DiskVCD Vdeio Compact DiskLCD Liquid Crystal DisplayCAD Computer AID DesignCAM Computer AID ManufacturingCAE Computer AID EngineeringABIOS Achanced Basic in put/output system 先进的基本输入/输出系统CMOS Complemeruary Metoll Oxide Semiconductor 互补金属氧化物半导体 PDA Personal Digital Assistant 个人数字助理IC Integrated Circuit 集成电路ISA Industry Standard Architecture 工业标准体制结构MCA Micro Channel Architecture 微信道结构EISA Extended Industry Standard Architecture 扩充的工业标准结构 SIMM Single in-line memory module 单项导通汇流组件DIMM Dual in-line Memory Module 双项导通汇流组件LED Light-Emitting Diode 发光二级管FMEA Failure Mode Effectivenes 失效模式分析W/H Wire Harness 金属线绪束集组件F/C Flat Calle 排线PCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WPR Weekly Delivery Requirement 周出货要求PPM Parts Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requiremcnt Planning 物料需计划OC Operation System 操作系统TBA To Be Design 待定,定缺D/C Drawing ChangeP/P Plans & ProceduneEMI Electrical-Music Industry 电子音乐工业RFI Read Frequency Input 读频输入MMC Maximum Material ConditionMMS Maximum Material SizeLMC Least Material ConditionLMS Least Material SizeES 工程规范 Engineering SpecificationKCC 关键控制特性（GM）Key Control CharacteristicKPC 关键产品特性（GM）Key Product CharacteristicOEM 整车厂 Original Equipment ManufacturerSC重要(特殊)特性 Significant(Special) CharacteristicANOVA 方差分析法 Analysis of VarianceCFT 多方论证小组 Cross function TeamDFMEA 设计失效模式及后果分析 Design Failure Mode and Effects Analysis DOE 试验设计 Design of Experiment0DVP&R 设计验证计划和报告 Design verification Plan and Report FTC 试生产能力 First Time CapabilityGR&R 量具的重复性和再现性Gage Repeatability and ReproducibilityPFMEA 过程失效模式及后果分析Process Failure Mode and Effect Analysis SFMEA 系统失效模式及后是分析 System Failure Mode and Effect Analysis QSR 质量体系要求 Quality System RequirementQFD 质量功能展开 Quality Function DeploymentTGR 运行情况良好 Things Gone RightTGW 运行情况不良 Things Gone WrongVE/VA 价值工程/价值分析 Value Engineering/Value Analysis0BOM 物料清单 Bill of MaterialCpk 稳定过程的能力指数 Capability for stable processLCL 下控制限 Lower Control LimitUCL 上控制限 Upper Control LimitLSL 工程规范下限 Lower Specification LimitUSL 工程规范上限 Upper Specification LimitPpk 性能指数 The performance indexMRB 物料评审 Material Review BoardPSW 零件提交 Part Submission WarrantX(―)--R图 均值一极差图 Average-Range Chart0SRPC 供方要求产品更改 Supplier Request for Product ChangeSREA 供方工程批准的要求 Supplier Request for Engineering Approval IAA 临时批准授权 Interim Approval AuthorizationAAR 外观件批准报告 Appearance Approval ReportPTR 试生产(报告) Production Trial Run (Report)DCP尺寸控制计划(动态控制计划)Dimension Control Plan (Dynamic Control Plan)POKA-YOKE（Mistake Proofing）防错BS: Board Split 分板BD: Boart Check 检板PD: Program Download 下载程序SDB: Serial&Data Burn In 烧码PT: PCBA Test PCBA测试PFT: PCBA Functin Test 开机检验FHA: Front Housing Assy 前盖组装RHA: Rear Housing Assy 后盖组装PA: PCB Assy PCBA组装CS: Close & Screw 合盖打螺丝FAT: Function Advance Test 手机预测试MT: Moblie Test 整机测试FCT: Final Check Test 整机完成测试LA: LENS Assy 装配LENLP: LENS Press 合压LENSSFT: Surface & Function Test 外观与检测Packing 包装FQA: FQA 终检AC Alloting Center 调拨室OEM Original Equipment ManufacturerANOVA 方差分析法 Analysis of VarianceDFMEA 设计失效模式及后果分析 Design Failure Mode and Effects AnalysisDOE 试验设计 Design of ExperimentGR&R 量具的重复性和再现性Gage Repeatability and Reproducibility PFMEA 过程失效模式及后果分析Process Failure Mode and Effect AnalysisQSR 质量体系要求Quality System RequirementQFD 质量功能展开 Quality Function DeploymentBOM 物料清单 Bill of MaterialCpk 稳定过程的能力指数 Capability for stable processLCL 下控制限 Lower Control LimitUCL 上控制限 Upper Control LimitLSL 工程规范下限 Lower Specification LimitX(─)--R图 均值一极差图 Average-Range Chart防错（POKA-YOKE）Mistake ProofingETA 预计到达 Estimate to be arrivePO 定单 Purchase orderM/C 机器 machineRFQ 报价需求 Request for quotationMFI 熔融流动指数 Melt flow indexFAI 全尺寸检测报告 First article inspectionCOC 材质证明 Certificate of complianceALT 加速老化试验 Accelerated life testCRR 承认书 Component review reportOT 加班 Over timeCAP 矫正计划 Corrective action planR&D 研发 Research and DevelopmentASAP 尽快 As soon as possibleECN工程更改通知Engineering change noticeDCN 设计更改通知 Design change 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